Bill Infantolino serves as a technical interface among the IEEC, its member companies and university researchers. He develops project proposals, provides technical direction and manages these projects in the IEEC. Bill consults with member companies in the area of electronics packaging and is also involved in corporate recruiting. Bill also manages the consumer electronics product teardown activity. This involves the analysis of electronics packaging technology used in state-of-the-art consumer electronic products including investigation of new designs, components, processes, materials, and assemblies.

Bill joined the IEEC after a 24-year career with IBM Microelectronics in Endicott, New York. He held a variety of engineering and management positions in the area of electronic packaging. The primary focus of his work was doing a wide variety of thermal and mechanical modeling and testing in support of product development, reliability evaluation, and solving manufacturing concerns for IBM and external customers. Bill also has held a variety of positions in laminate, module, and assembly product and process development. His experience spans a broad range of topics including circuit cards and boards; laminate, tape, and ceramic chip carriers; interconnect reliability; and system level design. Bill holds 9 patents in the area of electronic packaging and has several papers published in conference proceedings. He has also worked for Lockheed Martin and Exxon Research and Engineering. Bill received his MS and BS engineering degrees from Clarkson University.  

 

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