Mike DiPietro is responsible for the vigorous transfer of technology from the IEEC to industry. Although his primary focus is on New York State, the objective is to transfer technology to all interested domestic firms. His activities include outreach, which involves the collection of information and its dissemination to industrial firms and research staff; matching Center resources to industry's needs; and exploiting technology to meet specific needs.

Mike joined the IEEC after a diversified 28-year in IBM substrate and module manufacturing, engineering, and development. He managed a self-contained business unit that manufactured precision flexible circuits, TAB, and T-BGA substrates and packages. He had worldwide responsibility for module process and equipment commonality. Activities included introduction of new processes and equipment, defining qualification plans and schedules, and line support during the build cycle. His primary focus was on Organic Ball Grid Array packages and associated manufacturing services. Mike served as the IBM representative on the EIA-JEDEC JC-11 Committee for Mechanical Standardization. He was also named Chairman of JC-11.4 Point Committee, Uncased Devices (TAB and BGA Packages). Immediately prior to joining the IEEC, Mike was Director of Operations for the Pac Sign Co., Vestal, New York.

Mike attended SUNY Buffalo, University of Vermont, Erie County Community College, and Niagara County Community College.

Copyright © 2000 [IEEC]. All rights reserved. Revised: February 28, 2002 .