IEEC - Frank Andros - Technology Analyst

Frank Andros acts as a technical interface among the Center, its researchers, and its member companies. He participates in research proposal reviews and selections and acts as a consultant to university researchers for proposal generation and research focus. Frank also consults with IEEC member companies on packaging-related topics. He also is involved with the IEEC Teardown initiative, corporate recruiting, and liaison with the New York State Science and Technology Foundation and the National Science Foundation. He maintains an electronics packaging library in the Center.

Frank joined the IEEC after retiring from a 29-year career as a Senior Engineer with IBM Microelectronics at Endicott, New York. He held engineering and management positions in both development and manufacturing in the area of electronics packaging. His experience spans a broad range of technologies, including metallized ceramics, flex circuits, and printed circuit cards and boards. He has had experience with pin grid array, ball grid array, and surface mount component chip carriers, including design, development, bond and assembly, and card attach. Frank received a PhD and MS in mechanical engineering from Arizona State with specializations in the areas of heat transfer and fluid mechanics. He received a BS from Michigan Tech.