IEEC Newsletter

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IEEC News is published by the Integrated Electronics Engineering Center The New York State Center for Advanced Technology in Electronics Packaging Thomas J. Watson School of Engineering and Applied Science State University of New York at Binghamton

Editor: Marilyn Angelo

• Research Highlights
• Current Research
• IPC Tapes available
• Solder Research
• New Members

 

Copyright © 2000 [IEEC]. All rights reserved. Revised: May 18, 2002.