Each year the IEEC sponsors a series of research projects. These projects are chosen by the Director of the IEEC with the advice of the Technical Advisory Board. The projects listed below are funded for July 2003 - June 2004.
Stable Conducting Polymer Materials for Electronics Packaging, Prof. Wayne Jones, Chemistry
Novel Sensors and Plating Techniques for Electronic Packaging Applications, Prof. Omowunmi Sadik, Chemistry
Wetting Performance Evaluation of Selected Pb-Free Alloy/Substrate Pairs, Prof. Timothy Singler, Mechanical Engineering
Heat Transport in Thermal Interface Materials, Prof. Gary Lehmann, Mechanical Engineering
Evolution of the Microstructure of Pb-Free Solder Joints, Prof. Eric Cotts, Physics and Prof. Daryl Santos, Systems Science and Industrial Engineering
Characterization of Thermal Interface Materials, Prof. Eric Cotts, Physics
Examination of Solder/Metal Reactions in Advanced Systems, Prof. Eric Cotts, Physics
Characterization of Interface Adhesion in Electronics Packaging, Prof. Junghyun Cho, Mechanical Engineering
Development of Higher Sensitivity Infra-Red Fizeau Interferometer (IRFI) for Real-Time Out-of-Plane Deformation Measurement, Prof. SB Park, Mechanical Engineering
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© 2000 [IEEC]. All rights reserved. Revised: November 9, 2003.