IEEC - Current Research

Interface Adhesion between Organic Materials and Lead frames, Junghyun Cho, Mechanical and Materials Engineering

Thermal Conduction at Interfaces between Thermal Interface Materials and Substrates: Reduction of Bond-Line Thermal Resistance Through Substrate Surface Treatment, Eric J. Cotts, Materials Science and Engineering Program and Physics Department

The Effect of Spalling and Other Microstructural Factors on the Reliability of Pb-Free and PbSn Solder Joints, Eric J. Cotts, Materials Science and Engineering Program and Physics Department

A study of the Factors Which Control Void Formation in Cu/SAC Solder Joints, Nikolay Dimitrov, Chemistry and Eric Cotts, Physics

Design, Testing and Reliability of Passive Optical Components for Optical Interconnects Integrated on Package, Oana Malis, Physics Department and Materials Science and Engineering Program

Holographic Interferometry for Misalignment Measurements in Photonic Packaging Applications, Vladimir V. Nikulin, Electrical and Computer Engineering

Predictive Model of Moisture Behavior and its Reliability Impact on Microelectronics and MEMS – Crack Growth Model during Reflow and Reliability Testing, SB Park, Mechanical Engineering

Mechanical Shock/Drop Performance of Packaging Interconnects: Modeling and Measurement, James M. Pitarresi, Mechanical Engineering

A comparative Study of Mechanical Testing Reliability Techniques for Pb-Free Electronics Assemblies, James M. Pitarresi, Mechanical Engineering and Daryl Santos, Systems Science and Industrial Engineering

Dispersion of Carbon Nanotubes into Polymer Composites to Develop Improved Electronics Packaging Materials, Daryl Santos, Systems Science and Industrial Engineering and Wayne E. Jones, Jr., Chemistry

Computational Modeling and Experiments for Underfill Process Enhancement, Ying Sun, Mechanical Engineering and Timothy Singler, Mechanical Engineering

Integration of Vertically Aligned Carbon Nanotube and Randomly Oriented Metal Nanowire Composites for Thermal Interface Materials, Howard Wang, Mechanical Engineering, Wayne E. Jones, Jr., Chemistry