1. A Partnership in Scientific Research and Education," The Center for Photoinduced Charge Transfer, National Science Foundation, July 1993.
2. "Advanced Packaging: Key Technology for the 1990s," Dennis Herrell, MCC; Distinguished Lecture Series, Volume III: Industry Leaders in Computer Science and Electrical Engineering, © MCC, 1991.
3. "Innovations for the Circuit Century," Business Today Show, February 8, 1994.
4. "Current Status and Future Prospects for the CAT and S/IUCRC," Harry Kroger, IEEC Seminar, November 8, 1993.
5. "Do Solder Joints Provide Increased Lead Compliance?" Prof. James Constable, Electrical Engineering, IEEC Seminar, April 13, 1994.
6. "Electronics Packaging in the 90s," Part II, North Hampton College.
7. "Electronics Packaging Overview," IBM Endicott, April 1994.
8. Electronics Packaging Trends Update," R.J. Prosman, IEEC Technology Analyst, November 1992.
9. "5th Annual Binghamton University Electronics Packaging Symposium," Media Coverage - WMGC-TV.
10. "Finite Element Modeling of Gull-Wing Leads," James Pitaressi, Mechanical Engineering, IEEC Seminar, November 22, 1993.
11. "Futurevision," Motorola Government and Systems Technology Group.
12. "GE Aircraft Engine Electronics," courtesy of Martin Marietta.
13. "GSMI (4681)," courtesy of Universal Instruments Corp., NTSC, August 1993.
14. "Helping to Shape New York State's Economic Future in Electronics Packaging," IEEC Integrated Electronics Engineering Consortium. (3 copies)
15. "IEEC Industrial Seminar," DEC, IBM, Universal Instruments, Martin Marietta, April 29, 1993.
16. IEEC Seminar Series, James Pitarresi, March 16, 1992.
17. IEEC Seminar Series, Gary Lehmann, March 23, 1992.
18. IEEC Seminar Series, James Constable, March 29, 1992.
19. IEEC Seminar Series, Hari Srihari, April 6, 1992.
20. IEEC Seminar Series, Jiayuan Fang, April 13, 1992.
21. IEEC Seminar Series, Dick Prosman, (two copies), April 22, 1992.
22. IEEC Seminar Series, Mani Prakash, April 27, 1992.
23. IEEC Seminar Series, Monish Chatterjee, May 11, 1992.
24. IEEC Seminar Series, Timothy Singler, October 8, 1992.
25. IEEC Seminar Series, Peter Engel, October 22, 1992.
26. IEEC Seminar Series, Jiayuan Fang's Students, November 5,1992.
27. IEEC Seminar Series, Dick Prosman, November 12, 1992.
28. IEEC Spring Packaging Seminar, Dr. Mani Prakash, Mechanical Engineering, April 16, 1993.
29. IEEC Spring Seminar, Jim Constable, March 5, 1993.
30. IEEC Spring Seminar, Andrew Tay, March 17, 1993.
31. IEEC Spring Seminar, Ray Fillion, GE CR&D, April 13, 1993.
32. IEEC Spring Seminar, "Conductive Adhesives, Li Li and Jim Morris, May 21, 1993.
33. "Impact Wear of Multi Plated Electrical Contacts," Qian Yang, M&IE Dept., IEEC Seminar, November 1, 1993.
34. "Integrated Electronics Engineering Center," IEEC.
35. "Introducing JetClean Controlled Agitation Cleaning System," Martin Marietta.
36. "Lyle Feisel's Talk," Integrated Electronics Engineering Center (IEEC).
37. Matco Electronics Group, Vestal, NY, Video Cassette, 1995.
38. "Microfocus: X-ray Technology that Goes Beyond the Leading Edge," FeinFocus U.S.A., Inc.
39. "Modeling of I Noise in High Speed Electronics Packaging," Jiayuan Fang, Electrical Engineering, IEEC Seminar, November 15, 1993.
40. "Multi-Level Interconnect Technology," (Volumes 1-3, 2 copies of volume 3), S. Hurarka, RPI; Dr. S. Sivarah, Sematech; J.W. McPherson, TI; Dr. D. Bartelink, H-P; courtesy of Semiconductor Research Corporation.
41. "Nepcon West '92," courtesy of Universal Instruments, NTSC, March 1992.
42. "Northeast Regional B-2 Industrial Base Symposium," hosted by Loral Federal Systems-Owego, June 1994.
43. "Precision Pad Technology," produced by Mask Tek, from G. Arnold.
44. "Submicron CMOS Technology Scaling Issues," Dr. Roger A. Haken, Distinguished Lecture Series, Volume II: Industry Leaders in Computer Science and Electrical Engineering, © Texas Instruments, Inc., 1989 (University Video Communications).
45. "The Signal," W.L. Gore Associates, Inc., (2 copies) 1991.
     
    

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