IEEC - Theses

1. Wei Lin, Ph.D. Dissertation, August 1995, “High Quality Tour Hybrid Genetic Schemes for TSP Optimization Problems.”

2. Danwei Xue, Ph.D. Dissertation, 1997, “Modeling and Simulation of Electromagnetic Wave Propagation in Electronic Packages.”

3. Matthew John Aubrey, Masters Thesis, 1996, “Boundary Restraint Characterization of Wedge Style Circuit Card Retainers.”

4. W.J. Fischer, Masters Thesis, 1996, “Development of a Fiber-Filled Elastomer for Enhanced Conductive Cooling.”

5. S. Krishnan, Masters Thesis, 1992, “Design for Manufacturing for Surface Mount PCB Assembly.”

6. Yu-Lin Hwang, Masters Thesis, 1992, “An Adaptable Knowledge Base for Design for Manufacturability by Object-Oriented Approach.”

7. R.H. Fenton, Masters Thesis, 2000, “A Technique for Modeling the Warpage of an Area Array Component.”

8. M. Nagarajan, Masters Thesis, 2000, “Thermal Fatigue Life Prediction of Ceramic Ball Grid Array Assemblies.”

9. J.R. Rayner, Masters Thesis, 2000, “Identification of Error Sources in Mechanical Measurements of Electronic Packages using MoirJ Interferometry.”

10. S. Sethuraman, Masters Thesis, 2000, “Modeling and Reliability Analysis of Chip Scale Packages.”

11. M. Seus, Masters Thesis, 2000, “Optical Measurement of Electronic Packages: Improvements to Existing Techniques.”

12. J. Weidler, Masters Thesis, 2000, “Electrical Characteristics of an ACF Board.”

13. A. Sargent, Ph.D. Dissertation, 2000, “Kinetics, Mechanism and Detection of the Reactive Intermediates of Dimethylamine Borane in Electroless Gold Baths.”

14. A.A. Primavera, Ph.D. Dissertation, 2000, “Reliability Improvement of Area Array Solder Joints: Changing Attachment Pad Geometry.”

15. S.P. Watson, Masters Thesis, 2000, “Computational Parameter Study of Chip Scale Package Array Cooling.”

16. Vainateya, Masters Thesis, 2000, “Simulation of Slip Defect Generation on Gallium Arsenide Wafers during a Molecular Beam Epitaxy Process using Finite Element Method.”

17. D.A. Davidson, Masters Thesis, 2001, “Thermal Performance of Liquid Solder Joint between Metal Faces.”