1. JTEC Panel Report on Electronic Manufacturing and Packaging in Japan: Final Report, International Technology Research Institute at Loyola College, February 1995, ISBN 1-883712-37-8.
2. Verhofstadt, Peter, 1993 Annual Report of Research, Volume 1: Design Sciences (Millissa S. Allen and Nacia Avera, eds.), Semiconductor Research Corp., February 1994.
3. Kelly, John, 1993 Annual Report of Research, Volume V: Packaging Sciences (Millissa S. Allen and Nacia Avera, eds.), Semiconductor Research Corp., February 1994.
   
4. CINDAS Report 109: Thermal, Mechanical, Electrical, and Physical Properties of Selected Packaging Materials (Part 2), Prepared for Semiconductor Research Corp., December 1993.
5. JTEC Panel Report on X-Ray Lithography in Japan: Final Report, Coordinated by Loyola College in Maryland, October 1991, NTIS Report # PB92-100205.
6. JTEC Program Summary (Patricia N. Rogers, ed.), Coordinated by Loyola College in Maryland, September 1991.
   
7. Materials Science and Engineering Laboratory: Polymers, Technical Activities 1995, NSTIR 5749, U.S. Dept. of Commerce, Technical Administration, National Institute of Standards and Technology.
   
8. Executive Report to the Electronic Industries, EIA Publication. 
   
9. National Science Board Report, 1991, Tenth Edition, Science & Engineering Indicators.
   
10. TEKES, The Electronics Design and Manufacturing Technology Programme, 1991-1995, Final Report.
11. NYSERDA Annual Report, 1996-97.
12. CCAMTF Report: Screening Test Results for Developing Guidelines for Conformal Coating Usage and for Evaluating Alternative Surface Finishes, June 1997.
13. ITRI/Sematech Chip Carrier Phase 1 Report, September 30, 1998, 98093001-G.
    
    

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