IEEC - Books (10/4/01)

1. Flick, Ernest W., Adhesives, Sealants and Coatings for the Electronics Industry, Second Edition, Noyes Publications, Park Ridge, NJ, 1992, ISBN 0-8155-1295-3.

2a. Advances in Thermal Modeling of Electronic Components and Systems, Volume 1 (2 copies) (Eds. Avram Bar-Cohen and Allan D. Kraus), Hemisphere Publishing Corporation, New York, NY, 1988. ISBN 0-89116-689-0.

2b. Advances in Thermal Modeling of Electronic Components and Systems, Volume 2 (Eds. Avram Bar-Cohen and Allan D. Kraus), ASME Press, New York, NY, 1990. ISBN 0-7918-0015-6.

2c. Advances in Thermal Modeling of Electronic Components and Systems, Volume 3 (Eds. Avram Bar-Cohen and Allan D. Kraus), ASME Press, New York, NY, 1993. ISBN 0-7918-0018-0.

2d. Advances in Thermal Modeling of Electronic Components and Systems, Volume 4 (Eds. Avram Bar-Cohen and Allan D. Kraus), ASME Press, New York, NY, 1998. ISBN 0-7918-0065-2.

3. number replaced by 2b.

4. Terano, Toshiro; Asai, Kiyoji; and Sugeno, Michio, Applied Fuzzy Systems, Academic Press Professional, Cambridge, Massachusetts, 1989, ISBN 0-12-685242-1.

5. Hwang, Jennie S., Ball Grid Array & Fine Pitch Peripheral Interconnections: A Handbook of Technology & Applications for Microelectronics/Electronics Manufacturing; Electrochemical Publications Ltd., 1995, ISBN 0-901150-29-0.

6. Ball Grid Array Technology (Ed. John H. Lau), R. R. Donnelley & Sons Co., 1995, ISBN 0-07-036608-X.

8. Rahn, Armin, The Basics of Soldering, John Wiley & Sons, Inc., New York, NY, 1993, ISBN 0-471-58471-1.

9. Characterization of Integrated Circuit Packaging Materials (Eds. Thomas M. Moore and Robert G. McKenna), Butterworth-Heinemann, Boston, MA, 1993, ISBN 0-7506-9267-7.

10. Chip On Board: Technologies for Multichip Modules (Ed.John H. Lau), Van Nostrand Reinhold, 1994. ISBN 0-442-01441-4.

11. Bakoglu, H.B., Circuits, Interconnections, and Packaging for VSLI, Addison-Wesley Publishing Company, New York, NY, 1990, ISBN 0-201-16008-6.

12. Solberg, Vern, Design Guidelines for Surface Mount and Fine Pitch Technology, Second Edition, McGraw-Hill, New York, NY, ISBN 0-07-059577-1.

13. Dictionary of Scientific and Technical Terms, Fifth Edition (Ed. in Chief, Sybil P. Parker), McGraw-Hill, New York, NY, 1994, ISBN 0-07-042333-4.

14. Kavanagh, Paul, Downsizing for Client/Server Applications, Academic Press Professional, Cambridge, Massachusetts, 1995, ISBN 0-12-402680-X.

15. Electronic Materials Handbook: Volume I, Packaging, ASM International Handbook Committee, Materials Park, OH, 1989, ISBN 0-87170-285-1 (v. 1).

16. Landers, Thomas L.; Brown, William D.; Fant, Earnest W.; Malstrom, Eric M.; Schmitt, Neil M., Electronics Manufacturing Processes, Prentiss-Hall, Englewood Cliffs, NJ, 1994, ISBN 0-13-176470-5.

17. Harper, Charles A. and Sampson, Ronald M., Electronic Materials & Processes Handbook, Second Edition, McGraw-Hill, Inc., 1994. ISBN 0-07-054299-6.

18. Electronic Packaging and Interconnection Handbook (two copies) (Ed. in Chief, Charles A. Harper), McGraw-Hill, Inc., New York, NY, 1991, ISBN 0-07-026684-0.

19. Electronics Packaging Forum: Volume 1 (two copies) (Ed. James E. Morris), Van Nostrand Reinhold, New York, NY, 1990, ISBN 0-442-0017809 (v.1).

20. Electronics Packaging Forum: Volume 2 (two copies) (Ed. James E. Morris), Van Nostrand Reinhold, New York, NY, 1991, ISBN 0-442-00476-1 (v.2).

21. Electronics Packaging Forum: Multichip Module Technology Issues (two copies) (Ed. James E. Morris), IEEC Press, New York, NY, 1994, ISBN 0-7803-0439-X.

22. Tittel, E. and Robbins, M., E-mail Essentials, Academic Press, Inc., AP Professional, Cambridge, MA, 1994, ISBN 0-12-691397-8.

23. Engineered Materials Handbook: Volume 1, Composites, ASM International, 1987. ISBN 0-87170-279-7 (v. 1), SAN 204-7586.

24. Engineered Materials Handbook: Volume 2, Engineering Plastics, ASM International, 1988. ISBN 0-87170-279-7 (v. 1), SAN 204-7586.

25. Engineered Materials Handbook: Volume 3, Adhesives and Sealants, ASM International, 1990. ISBN 0-87170-279-7 (v. 1), SAN 204-7586, ISBN 0-87170-281-9.

26. Engineered Materials Handbook: Volume 4, Ceramics and Glasses, ASM International, 1991. ISBN 0-87170-282-7, SAN 204-7586.

27. Marcoux, Phil P., Fine Pitch Surface Mount Technology: Quality, Design, and Manufacturing Techniques, Van Nostrand Reinhold, New York, NY, 1992, ISBN 0-442-00862-7.

28. Fjelstad, Joseph, Flexible Circuit Technology, Silicon Valley Publishers Group, Campbell, CA 1994.

29. Stearns, Thomas H., Flexible Printed Circuitry, McGraw-Hill, New York, 1996, ISBN 0-07-061032-0.

30. Flip Chip Technologies (ed. John H. Lau), McGraw-Hill, New York, 1996, ISBN 0-07-036609-8.

31. McNeill, F. Martin and Thro, Ellen, Fuzzy Logic: A Practical Approach, Academic Press Professional, Cambridge, Massachusetts, 1994, ISBN 0-12-485965-8.

32. Cox, Earl, The Fuzzy Systems Handbook: A Practitioner's Guide to Building, Using, and Maintaining Fuzzy Systems, Academic Press Professional, Cambridge, Massachusetts, 1994, ISBN 0-12-194270-8.

34. General Requirements for Implementation of Statistical Process Control, ANSI/IPC-PC-90, IPC, Lincolnwood, IL, October 1990.

35. Guidelines for Multichip Module Technology Utilization, IPC-MC-790, IPC, Lincolnwood, IL, July 1992.

36. Handbook of Electronic Package Design (Ed. Michael Pecht), Marcel Dekker, Inc., 1991. ISBN 0-8247-7921-5.

37. Matisoff, Bernard S., Handbook of Electronics Packaging Design and Engineering (Second Edition), Van Nostrand Reinhold, New York, NY, 1990, ISBN 0-442-26502-6.

38. Handbook of Fine Pitch Surface Mount Technology (two copies) (Ed. John H. Lau), Van Nostrand Reinhold, 1994. ISBN 0-442-01258-6.

39. Handbook of Plastics, Elastomers, and Composites: 2nd Edition (Ed. Charles A. Harper), McGraw-Hill, New York, NY, ISBN 0-07-026686-7.

40. Handbook of Tape Automated Bonding (Ed. John H. Lau), Van Nostrand Reinhold, New York, NY, 1992. ISBN 0-442-00427-3.

41.  Johnson, Howard W. And Graham, Martin, High-Speed Digital Design: A Handbook of Black Magic, Prentice Hall PTR, New Jersey, 1993, ISBN 0-13-395724-1.

42. Licari, James J. and Enlow, Leonard R., Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production, Noyes Publications, Park Ridge, NJ, 1988, ISBN 0-8155-1152-3.

43. Hybrid Microelectronics Handbook, Second Edition (Eds. Jerry E. Sergent and Charles A. Harper), McGraw-Hill, Inc., New York, NY, 1995, ISBN 0-07-026691-3.

44. Pecht, Michael, Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, John Wiley & Sons, Inc., 1994, ISBN 0-471-59446-6.

46. O'Mara, William C., Liquid Crystal Flat Panel Display: Manufacturing Science & Technology, Van Nostrand Reinhold, New York, NY, 1993, ISBN 0-442-01428-7.

47. Low-Temperature Electronics (Ed. Randall K. Kirschman), IEEE Press, 1986, ISBN 0-87942-206-8.

48. Mastering & Implementing BGA Technology, AEIC, 1995

49. Frear, Darrel; Morgan, Harold; Burchett, Steven; and Lau, John, The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, 1994. ISBN 0-442-01505-4.

50. Yost, Frederick G., Hosking, F. Michael, and Frear, Darrel R., The Mechanics of Solder Alloy Wetting & Spreading, Van Nostrand Reinhold, 1993. ISBN 0-442-01752-9.

51. Grovenor, Christopher R. M., Microelectronic Materials, Institute of Physics Publishing, 1994. ISBN 0-85274-270-3 (paperback), ISBN 0-85274-269-X (hardback).

52.   Microelectronic System Interconnections: Performance and Modeling (Ed. Stuart K. Tewksbury), IEEE Press, New York, NY 1994, ISBN 0-7803-0405-5.

53. Microelectronics Manufacturing Diagnostics Handbook (Ed. Abraham H. Landzberg), Van Nostrand Reinhold, 1993. ISBN 0-442-00471-0.

54. Microelectronics Packaging Handbook (Eds. Rao R. Tummala and Eugene J. Rymaszewski), Van Nostrand Reinhold, New York, NY, 1989. ISBN 0-442-20578-3.

55. Motorola Semiconductor Products Inc., Microprocessor Applications Manual, McGraw-Hill Book Co., 1975, ISBN 0-07-043527-8.

56. Modern Electroplating (Third Edition,) (Ed. Frederick Lowenheim), John Wiley & Sons, New York, NY, 1974, ISBN 0-471-54968-1.

57. Multichip Module Technologies and Alternatives: The Basics (Eds. Daryl Ann Doane, Paul D. Franzon), Van Nostrand Reinhold, New York, NY, 1993, ISBN 0-442-01236-5.

58. Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (two copies), (Eds. R. Wayne Johnson, Robert K.F. Teng and John W. Balde), IEEE Press, New York, NY, 1991, ISBN 0-87942-267-X.

59. Rao, Gopal K., Multilevel Interconnect Technology, McGraw-Hill, Inc., 1993, ISBN 0-07-051224-8.

60. Tittel, Ed and Robbins, Margaret, Network Design Essentials: Everything You Need to Know, Academic Press Professional, Cambridge, Massachusetts, 1994, ISBN 0-12-691395-1.

61. Simon, Alan R., Network Re-Engineering: Foundations of Enterprise Computing, Academic Press Professional, Cambridge, Massachusetts, 1994, ISBN 0-12-643840-4.

62. Noise and Vibration Control: Revised Edition 1988  (Ed. Leo L. Beranek), McGraw Hill, Inc., 1971.. ISBN 0-9622072-0-9.

63. Montgomery, Stephen L., Object-Oriented Information Engineering: Analysis, Design, and Implementation, Academic Press Professional, Cambridge, Massachusetts, 1994, ISBN 0-12-505040-2.

64. Simon, Alan R. and Wheeler, Tom, Open Systems Handbook, Second Edition, Academic Press Professional, Cambridge, Massachusetts, 1995, ISBN 0-12-643870-6.

65. Dally, James W., Packaging of Electronic Systems: A Mechanical Engineering Approach, McGraw-Hill Publishing Company, New York, NY, 1990, ISBN 0-07-015214-4.

66. Neugebauer, C.A., Yerman, A.F., Carlson, R.O., Burgess, J.F., Webster, H.F. and Glascock, H.H., The Packaging of Power Semiconductor Devices, Electrocomponent Science Monographs: Volume 7, Gordon and Breach Science Publishers, New York, NY, 1986, ISBN 2-88124-135-2.

67. Physical Architecture of VLSI Systems (Eds. Robert J. Hannemann, Allan D. Kraus, and Michael Pecht); John Wiley & Sonc, Inc., 1994, ISBN 0-471-53299-1.

68. Placement and Routing of Electronic Modules (Ed. Michael Pecht), Marcel Dekker, Inc., 1993. ISBN 0-8247-8916.

69. Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications (Eds. Michael G. Pecht, Luu T. Nguyen, and Edward B. Hakim), John Wiley & Sons, Inc., 1995, ISBN 0-471-30625-8.

70. Manzione, Louis T., Plastic Packaging of Microelectronic Devices, Van Nostrand Reinhold, New York, NY, 1990, ISBN 0-442-23494-5.

71. Seraphim, Donald P.; Lasky, Ronald; and Li, Che-Yu, Principles of Electronic Packaging, (two copies) McGraw-Hill Book Company, New York, NY, 1989, ISBN 0-07-056306-3.

72. Coombs, Clyde F., Jr., Printed Circuits Handbook, Fourth Edition, McGraw-Hill, Inc., New York, NY, 1996, ISBN 0-07-012754-9.

73. Stevens, Roger T., Quick Reference to Computer Graphics Terms, Academic Press Professional, Cambridge, Massachusetts, 1993, ISBN 0-12-668310-7.

74.  Reliability Assessment of Wafer Scale Integration Using Finite Element Analysis, Rome Laboratory, Griffiss AFB, NY, October 1991.

75. Harman, George G., Reliability and Yield Problems of Wire Bonding in Microelectronics, International Society for Hybrid Microelectronics, 1991. ISBN 0-930815-25-4.

76. Rome Laboratory Reliability Engineer's Toolkit: An Application Oriented Guide for the Practicing Reliability Engineer, Systems Reliability Division, AFMC, Griffiss AFB, NY, 1993.

77. Solder Joint Reliability: Theory and Applications (Ed. John H. Lau), Van Nostrand Reinhold, New York, NY, 1991, ISBN 0-442-00260-2.

78. Solder Mechanics: A State of the Art Assessment (Eds. D. R. Frear, W. B. Jones, and K. R. Kinsman), Minerals, Metals & Materials Society, 1990. ISBN 0-87339-166-7.

79. Manko, Howard H., Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, Van Nostrand Reinhold, New York, 1994, ISBN 0-442-01206-3.

80. Judd, Mike and Keith Brindley, Soldering in Electronics Assembly, BH Newness, East Kilbride, Scotland, 1992, ISBN 0-7506-0589-8.

81. Soldering Processes and Equipment (Ed. Michael G. Pecht), John Wiley & Sons, Inc., New York, NY, 1993, ISBN 0-471-59167-X.

82. Manko, Howard H., Solders and Soldering: Materials, Design, Production, and Analysis for Reliable Bonding, McGraw-Hill, Inc., 1992. ISBN 0-07-039970-0.

83. Julien, Christian and Nazri, Gholam-Abbas, Solid State Batteries: Materials Design and Optimization, Kluwer Academic Publishers, Boston, MA, 1994, ISBN 0-7923-9460-7.

85. Suhir, Ephraim, Structural Analysis in Microelectronic and Fiber-Optic Systems: Volume I, Van Nostrand Reinhold, New York, NY, 1991. ISBN 0-442-20771-9.

86. Engel, Peter A., Structural Analysis of Printed Circuit Board Systems, Springer-Verlag, New York, Mechanical Engineering Series, 1993, ISBN 0-387-97939-5, ISBN 3-540-97939-5.

87. Surface Mount Technology (Greg Caswell, Organizer), The International Society for Hybrid Microelectronics, Silver Spring, MD, 1984 (two copies), ISBN 0-930815-00-9.

88. Classon, Frank, Surface Mount Technology for Concurrent Engineering and Manufacturing, McGraw-Hill, Inc. 1993, ISBN 0-07--11200-2.

89. Surface Mount Technology: Recent Japanese Developments (Ed. Jan Vardaman), IEEE Press, New York, NY, 1993, ISBN 0-7803-0407-1.

90. Thermal Management Concepts in Microelectronic Packaging: from Component to System (Project Coordinator, Robert T. Howard, Eds. Stephen S. Furkay, Richard F. Kilburn, Gabriel Monti, Jr.), The International Society for Hybrid Microelectrinics, Silver Spring, MD, 1984, ISBN 0-930815-01-7.

91. Thermal Stress and Strain in Microelectronics Packaging (Ed. John H. Lau); Van Nostrand Reinhold, 1993, ISBN 0-442-01058-3.

92. Messner, George; Turlik, Iwona; Balde, John W.; Garrou, Philip E., Thin Film: Multichip Modules, International Society of Hybrid Microelectronics, Reston, VA, 1992, ISBN 0-930815-33-5.

93. Perry, Douglas L., VHDL, Second Edition, McGraw-Hill, Inc., New York, NY, 1994, ISBN 0-07-049434-7.

94. Pick, Joseph, VHDL Techniques, Experiments, and Caveats, McGraw-Hill, Inc., New York, NY, 1996, ISBN 0-07-049906-3.

95. Steinberg, Dave S., Vibration Analysis for Electronic Equipment (Second Edition), John Wiley & Sons, New York, NY, 1988, ISBN 0-471-63301-1.

96. 1995 Electronic Market Data Book: Statistical Yearbook of the Electronic Industries, Electronic Industries Association, 1995, ISBN 0-7908-0056-X.

97. Advances in Thermal Modeling of Electronic Components and Systems, Volume 3 (eds. Avram Bar-Cohen and Allan D. Kraus), ASME Press, New York, 1993. ISBN 0-7918-0018-0.

98. Corrosion Control by Coatings (ed. H. Leidheiser, Jr.), Science Press, Princeton, 1979. ISBN 0-89500-018-0.

99. Koch, Winston E., Engineering Applications of Lasers and Holography, Plenum Press, New York, 1975. ISBN 0-306-30849-5.

100. Hinch, Stephen W., Handbook of Surface Mount Technology, Longman Scientific & Technal, Essex, England, 1988. ISBN 0-582-00517-5.

101. Mandelkern, Leo, An Introduction to Macromolecules, Springer-Verlag, New York, 1972. ISBN 0-387-90045-4.

102 Brisky, Michael, Mastering SMT Manufacturing, SMT Plus, Inc., (Company publication).

103. Materials for Electronic Packaging (ed. Deborah D.L. Chung), Butterworth Heinemann, Boston, 1995, ISBN 0-7506-9314-2.

104. Microelectronics Packaging Handbook: Technology Drivers (Part I), Second Edition (Rao E. Tummala, Eugene J. Rymasewski and Alan G. Klopfenstein, eds.), Chapman & Hall, New York, 1997. ISBN 0-412-08431-7.

105. Microelectronics Packaging Handbook: Semiconductor Packaging (Part II), Second Edition (Rao E. Tummala, Eugene J. Rymasewski and Alan G. Klopfenstein, eds.), Chapman & Hall, New York, 1997. ISBN 0-412-08441-4.

106. Microelectronics Packaging Handbook: Subsystem Packaging (Part III), Second Edition (Rao E. Tummala, Eugene J. Rymasewski and Alan G. Klopfenstein, eds.), Chapman & Hall, New York, 1997. ISBN 0-412-08451-1.

107. Lea, C., A Scientific Guide to Surface Mount Technology, Electrochemical Publications, Ayr, Scotland, 1988. ISBN 0-901150-22-3.

108. Prasad, Ray P., Surface Mount Technology: Principles and Practice, Van Nostrand Reinhold, New York, 1989. ISBN 0-442-20527-9.

109. Prasad, Ray P., Surface Mount Technology: Principles and Practice, Second Edition, (2 copies) Chapman & Hall, New York, 1997. ISBN 0-412-12921-3.

110. Lall, Pradeep; Pecht, Michael G.; and Hakim, Edward B., Influence of Temperature on Microelectronics and System Reliability, CRC Press, New York, 1997. ISBN 0-8493-9450-3.

111. Harper, Charles A., Electronic Packaging & Interconnection Handbook (Second Edition), McGraw Hill, New York, 1997. ISBN 0-07-026694-8.

112. Woodgate, Ralph W., The Handbook of Machine Soldering: SMT and TH (Third Edition), John Wiley & Sons, Inc., New York, 1996. ISBN 0-471-13904-1.

113. Hwang, Jennie S., Modern Solder Technology for Competitive Eelctronics Manufacturing, McGraw Hill, New York, 1996. ISBN 0-07-031749-6.

114. Licari, James J., Multichip Module Design, Fabrication, & Testing, McGraw Hill, New York, 1995, ISBN 0-07-037715-4.

115. Alvino, William M., Plastics for Electronics: Materials, Properties, and Design Applications, McGraw Hill, 1995. ISBN 0-07-001435-3.

116. Quality Conformance and Qualification of Microelectronic Packages and Interconnects (Michael Pecht, Abhijit Dasgupta, John W. Evans and Jillian Y. Evans, eds.), John Wiley & Sons, New York, 1994. ISBN 0-471-59436-9.

117. Harman, George, Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield, McGraw Hill, New York, 1997. ISBN 0-07-032619-3.

118. Packaging, Intel Corp., Intel Publications, Mt. Prospect, IL, 1997, ISBN 1-55512-264-7.

119. Fjelstad, Joseph, An Engineer’s Guide to Flexible Circuit Technology, Electrochemical Publications, 1997. ISBN: 0-901150-43-7.

120. Smart Cards: Seizing Strategic Business Opportunities (Catherine Allen and William J. Barr, eds.), Irwin Professional Publishing, Chicago, IL, 1997. ISBN 0-7863-1108-8.

121. Elshabini-Riad, Aicha, and Fred D. Barlow III, Thin Film Technology Handbook, (2 copies) McGraw-Hill, New York, NY, 1997. ISBN 0-07-019025-9.

122. Manufacturing Challenges in Electronic Packaging (eds.Y.C. Lee, and W.T. Chen), Chapman & Hall, London, U.K., 1998. ISBN 0-412-62030-8.

123. Konsowski, Stephen G., and Arden R. Helland, Electronic Packaging of High Speed Circuitry, McGraw-Hill, New York, NY, 1997. ISBN 0-07-035970-9.

124. DiGiacomo, Giulio, Reliability of Electronic Packages and Semiconductor Devices, McGraw-Hill, New York, NY, 1996. ISBN 0-07-017024-X.

125. Jawitz, Martin W., Printed Circuit Board Materials Handbook, McGraw-Hill, New York, NY, 1997. ISBN 0-07-032488-3.

126. Design & Reliability of Solders and Solder Interconnections, (eds. R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Murty, PlK. Liaw, W.L. Winterbottom) TMS Minerals Metals Materials, Warrendale, PA (1997). ISBN: 0-87339-354-6.

127. Lao, John H. and Yi-Hsin Pao, Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies, McGraw-Hill, New York, 1997. ISBN 0-07-036648-9.

128. Srihari, K., C.R. Emerson, S. Krishnan, Y. Hwang, C.H. Wu, and C.W. Yeh, A ‘Design for Manufacturing’ Environment for Surface Mount PCB Assembly, A concise user’s guide. Dept. of Mech. and Industrial Engr., Watson School, SUNY Binghamton.

129. Ball Grid Array Packaging Guidelines, Jet Propulsion Laboratory, California Institute of Technology, BGAS Consortium Team, Distributed by ITRI, August 1998.

130. Connectors and Interconnections Handbook, Volume 1: Basic Technology (Gerald L. Ginsberg, ed.), The Electronic Connector Study Group, Inc. Fort Washington, PA, 1977. Lib. Congress No. 77-088086.

131. Connectors and Interconnections Handbook, Volume 4: Materials (Gerald L. Ginsberg, ed.), The Electronic Connector Study Group, Inc. Fort Washington, PA, 1983.

132. Metals Handbook: Ninth Edition. Volume 1, Properties and Selection: Irons and Steels, (Bruce P. Bardes, Ed.), American Society of Metals, 1978. ISBN 0-87170-7.

133. Metals Handbook: Ninth Edition. Volume 2, Properties and Selection: Nonferrous Alloys and Pure Metals, (Bruce P. Bardes, Ed.), American Society of Metals, 1979. ISBN 0-87170-008-5.

134. Metals Handbook: Ninth Edition. Volume 3, Properties and Selection: Stainless Steels, Tool Materials and Special-Purpose Metals, (Bruce P. Bardes, Ed.), American Society of Metals, 1980. ISBN 0-87170-009-3

135. Tool and Manufacturing Engineers Handbook, Third Edition (Daniel B. Dallas, Ed.-in-Chief), McGraw-Hill Book Co.,1976. ISBN 0-07-059558-5.

136. B.L. Gabriel, SEM: A User’s Manual for Materials Science, American Society for Metals, 1985. ISBN 0-87170-202-9.

137. Topics in Current Physics: Thin Film and Depth Profile Analysis (H. Oechsner, Ed.), Springer-Verlag, New York, 1984. ISBN 0-387-13320-8.

138. D.J. Sterling, Jr., Technician’s Guide to Fiber Optics, Delmar Publishers Inc. 1987. ISBN 0-8273-2612-2.

139. J.M. Senior, Optical Fiber Communications: Principles and Practice, Prentice-Hall, 1985. ISBN 0-130638248 7.

140. Pecht, Michael G., et al., Electronic Packaging Materials and their Properties, (two copies) CRC Press LLC, New York, 1999. ISBN 0-8493-9625-5.

141. McKeown, Stephen A., Mechanical Analysis of Electronic Packaging Systems, Marcel Dekker, Inc., New York, 1999. ISBN 0-8247-7-33-1.

142. Liu, Johan, Conductive Adhesives for Electronics Packaging, Electrochemical Publications, Isle of Man, British Isles, 1999. ISBN 0-901150-37-1.

143. Engineering Plastics & Composites (Second Edition), (William Andrew Woishnis, Ed.) ASM International, Materials Park, OH, 1993. ISBN 0-87170-483-8.

144. Microelectronic Failure Analysis: Desk Reference, Fourth Edition, (Richard J. Ross, Christian Boit, Donald Staab, eds.), ASM International, Materials Park, OH, 1999. ISBN 0-87170-638-5.

145. The Electronic Packaging Handbook (Glenn R. Blackwell, Ed.), CRC Press, Boca Ratan, FL, 1999. ISBN 0-8493-8501-1.

146. Advanced Electronic Packaging: With Emphasis on Multichip Modules (William Brown, ed.), IEEE Press, Piscataway, NJ, 1999. ISBN 0-7803-4700-5.

147. Marks’ Standard Handbook for Mechanical Engineers, Tenth Edition (Eugene A. Avallone, Theodore Baumeister III, Eds.), McGraw-Hill, New York, NY, 1996. ISBN 0-07-004997-1

148. Shewhart, Walter A., Statistical Method from the Viewpoint of Quality Control, Dover Publications, Inc., New York, 1986. ISBN 0-486065232-7.

149. Optoelectronic Packaging (Alan R. Mickelson, Nagesh R. Basavanhally, YungpCheng Lee, eds.), John Wiley & Sons, Inc, New York, 1997. ISBN 0-471-11188-0.

150. Failure Analysis of Integrated Circuits: Tools and Techniques (Lawrence C. Wagner, ed.), Kluwer Academic Publishers, Boston/Dordrecht/London, 1999. ISBN 0-412-14561-8.

151. Electronic Packaging and Interconnection Handbook (third edition) (Ed. in Chief, Charles A. Harper), McGraw-Hill, Inc., New York, NY, 2000, ISBN 0-07-134745-3.

152. High Temperature Electronics (eds. F. Patrick McCluskey, Richard Grzybowski, Thomas Podlesak), CRC Press, New York, NY, 1997, ISBN 0-8493-9623-9.

153. Lyshevski, Sergey Edward, Nano- and Microelectromechanical Systems: Fundamentals of Nano- and Microengineering, CRC Press, New York, NY, 2001. ISBN 0-8493-916-6.

154. Remsburg, Ralph, Thermal Design of Electronic Equipment, CRC Press, New York, NY, 2001, ISBN 0-8493-0082-7.

155. Prospering in a Global Economy: Linking Trade and Technology Policies (Eds. Martha Caldwell Harris and Gordon E. Moore), National Academy Press, Washington, DC, 1992. ISBN 0-309-0464509.

156. Microelectronics (Ed. Jerry C. Whitaker), CRC Press, Boca Raton, FL, 2000. ISBN 0-8493-0050-9.

157. Madou, Marc, Fundamentals of Microfabrication, CRC Press, Boca Raton, FL, 1997. ISBN 0-8493-9451-1.

158. Technology Transfer in Consortia and Strategic Alliances (Eds. David V. Gibson and Raymond W. Smilor), Rowman & Littlefield Publishers, Inc., Lanham, MD, 1992. ISBN o-8476-7717-6.

159. University Spin-Off Companies (Eds. Alistair Brett, David V. Gibson, and Raymond W. Smilor), Rowman & Littlefield Publishers, Inc., Lanham, MD, 1991. ISBN 0-8476-7646-3.

160. Pecht, Michael, Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, John Wiley & Sons, Inc., New York, NY, 1994. ISBN 0-471-59446-6.

161. Chigrinov, V.G., Liquid Crystal Devices: Physics and Applications, Artech House, Boston, MA, 1999. ISBN 0-89006-894-4.

162. Tummala, Rao R., Fundamentals of Microsystems Packaging, McGraw-Hill, New York, NY, 2001. ISBN 0-07-137169-9.

163. The MEMS Handbook (ed. Mohamed Gad-el-Hak), CRC Press, New York, NY, 2002. ISBN: 0-8493-0077-0.

164. Product Reliability, Maintainability, and Supportability Handbook (ed. Michael Pecht), CRC Press, New York, NY, 1995. ISBN: 0-8493-9457-0.

165. Thermal Measurements in Electronic Cooling (ed. Kaveh Azar), CRC Press, New York, NY, 1997. ISBN: 0-8493-3279-6.

Copyright © 2000 [IEEC]. All rights reserved. Revised: May 18, 2002.