Tear Down is a project that analyzes leading edge electronics systems to assess their electronics packaging content. It is a joint venture between the IEEC electronics packaging consortium at Binghamton University and Prismark Partners LLC. The purpose of the venture is to:
- Investigate the use of new or first-use packaging techniques, connectors, and component sets.
- Establish a knowledge base which, over time, will facilitate the projection of packaging trends, developments, and capabilities. Such projections can be used in turn for forecasting R&D directions.
This page will feature a Tear Down, an abstract of a recent and relevant Tear Down analysis activity. As abstracts are replaced by more current ones, they will be archived in a Tear Down Digest.
Unabridged teardown reports, which contain all technical data, photographs, and electronics packaging analysis, are provided to IEEC member companies and Prismark Partners clients. For information on becoming an IEEC member company or a Prismark Partners client, contact:
Integrated Electronics Engineering Center
Phone: (607) 777-4332
Fax: (607) 777-4683
E-Mail: IEEC@binghamton.eduPrismark Partners LLC
Phone: (631) 367-9187
Fax: (631) 367-9223
E-mail: partners@prismark.com
Copyright
© 2000 [IEEC]. All rights reserved. Revised: June 9, 2002.