Companies are invited to join the IEEC team as a sponsor, topical, participating or associate member. Membership provides a unique opportunity to share in leading edge electronics packaging research and development conducted at the Center. Industrial participation continues to stimulate closer interaction between the IEEC researchers and other consortium members.
The IEEC's industry sponsors include several major computer and process equipment manufacturers --
Sponsor Members:
- Analog Devices, Norwood, MA
- BAE Systems Controls, Johnson City, NY
- Corning Inc., Corning, NY
- Endicott Interconnect Technologies, Endicott, NY
- GE Corporate Research and Development
- IBM Microelectronics, East Fishkill, NY
- Lockheed Martin Systems Integration, Federal Systems, Owego, NY
- Samsung Electronics Inc., Ltd., Gyeonggi-Do, Korea
- STATS ChipPac Ltd., Singapore
- Texas Instruments
- Universal Instruments, Binghamton, NY
Participating Members:
- Amphenol
- Binghamton Semiconductor Packaging
- Boston Laser
- Oak Mitsui
- Prismark Partners L.L.C.
Associate Member
Copyright
© 2000 [IEEC]. All rights reserved. Revised:
September 27, 2007.