IEEC - Graduate Research Opportunities in Electronics Packaging

Graduate Research Opportunities in Electronics Packaging

The Watson School offers graduate education leading to the Master of Science(M.S.) and Doctor of Philosophy (Ph.D.) degrees in electrical, industrial, and mechanical engineering as well as in computer science and system science. Graduate students in the engineering programs enjoy the widest opportunity to do electronics packaging research in the IEEC.

Electronics Packaging Activity in the Departments

Faculty in electrical engineering are involved in advanced materials packaging research. Other interests include electromagnetic modeling and compatibility, manufacturing process control and optimization, and neural network applications in manufacturing.

Faculty research in industrial engineering is dedicated to advanced manufacturing and assembly. This includes the development of manufacturing processes and expert systems and computer software relevant to packaging manufacturing.

Research in mechanical engineering focuses on local manufacturing and assembly industries. IEEC researchers working in the field of advanced materials are concentrating on the development of the next generation of solder, thermally conductive materials, and new circuit board materials. Computational modeling of fluid, mechanical, and thermal behavior of computer packages aids in their design and manufacture.

Admissions and Financial Aid

The Integrated Electronics Engineering Center (IEEC), the largest research center in the Thomas J. Watson School of Engineering and Applied Science at Binghamton University, is one of the best places in the United States for graduate studies centered on electronics packaging. The center is backed by substantial federal and state funding, which is matched by funds from leading companies in the packaging industry. Graduate students have an extraordinary opportunity to work with distinguished faculty and industry researchers, both in state-of-the-art campus labs and in industrial settings.

The IEEC typically supports between 25 and 30 graduate research assistants each year. Research assistantships are generous and include tuition scholarships. Students who make rapid progress towards advanced degrees have an opportunity to obtain larger stipends. There are special opportunities for students who are graduates of New York colleges and universities

Graduate assistantships are awarded through individual faculty members. Students who wish to apply for an assistantship should therefore apply for admission to one of the academic departments.

Information on admissions and financial aid as well as application materials are available from the Graduate Admissions Office. For additional information on applying, contact the Watson School Advising Office by telephone at (607)777-6203 or via electronic mail.

In addition to the research assistantships offered by the IEEC, there are typically more than 25 research assistantships offered by faculty who are pursuing research in electronics packaging. These additional assistantships are supported directly by research contracts to the faculty from either industry or government agencies such as NSF and DARPA.