IEEC - Forum

The Joint Forum on Electronics Packaging is sponsored by:

The Integrated Electronics Engineering Center

The Institute of Electrical and Electronics Engineers

The Components, Packaging, and Manufacturing Technology Society

Its objective is to facilitate information exchange and discussion among the community of researchers, developers, manufacturers, and consumers of electronics packaging products and technologies. The operation of the forum is based on electronic mail and Internet communications.

The forum can benefit subscribers in a number of ways:

Researchers and technology leaders can exchange current information and data.

Small companies and newcomers to technology areas can solicit advice and assistance from technology leaders.

Participants can receive perspectives in areas such as technology trends and directions.

The Electronics Packaging Forum is managed electronically by a facility called LISTSERV, which accepts and terminates subscriptions, routes forum electronic mail to subscribers, and processes requests for information. Participation in the forum is accomplished by sending electronic mail to LISTSERV, to ELPKG-L (the forum itself), or to individual forum participants.

How to Subscribe

You make a subscription request by sending a command via electronic mail to listserv@bingvmb.cc.binghamton.edu. All that is required in the note is a single line of text that says:

SUBSCRIBE ELPKG-L Your_Name

For example, the line "SUBSCRIBE ELPKG-L A. Packaging Engineer" informs LISTSERV that Albert P. Engineer wishes to be known as "A. Packaging Engineer" on the Forum. (LISTSERV will pick up the E-mail address from the message header.) LISTSERV will respond to subscription requests with an acknowledgement and information "package."

How to Participate

You make a contribution to the forum (ask a question, answer a question, state a fact, etc.) by sending the contribution as electronic mail. Address it to ELPKG-L@bingvmb.cc.binghamton.edu. When your note is received, it is automatically forwarded to all ELPKG-L subscribers. Similarly, when another subscriber contributes, his or her contribution will be forwarded to all subscribers, including you. When you receive such a contribution via electronic mail, you can REPLY to it, but be aware that your reply will go to all of the ELPKG-L subscribers, not just the subscriber who made the contribution you replied to.

How to "Unsubscribe"

Send E-mail to listserv@bingvmb.cc.binghamton.edu. Put a single line in the note that says "SIGNOFF ELPKG-L." This requests that your subscription be terminated. Your request will be acknowledged.

Other Pertinent LISTSERV Commands

The following additional commands may be included in E-mail to listserv@bingvmb.cc.binghamton.edu:

INDEX ELPKG-L requests an index of electronics packaging information files held by LISTSERV. (The index file will be sent if any such files exist.)

GET ELPKG-L filetype requests a specific information file, which is distinguished by the name filetype.

There are other LISTSERV commands. You can request a "reference card" summarizing all of them with the command: INFO REFCARD.

Also, the command: INFO ? requests a list of LISTSERV information files.

Contributions to the forum are automatically archived. The archives can be accessed using the INDEX and GET commands described above.

For additional details, contact the ELPKG-L List Owner.

CPMT VLSI Packaging Newsletter